Planetary Lapping Machines

2 SIDE LAPPING MACHINES

This double sided lapping machine is ideal lapping tool for lapping silicon wafers and germanium wafers.

MODELS AVAILABLE:

24-01: Lap Plate OD : 362mm

24-02: Lap Plate OD : 590mm

24-03: Lap Plate OD : 900mm

ADVANTAGES:

GMT Planetary Lapping Machines can lap both sides of a work piece simultaneously. As a consequence work pieces are processed efficiently without manual interruption and improved parallelism and acts as an surface finishing machine. This double sided lapping machine is ideal lapping tool for lapping silicon wafers and germanium wafers.

GMT planetary lapping machines finds application in electronics, quartz, ceramics, semiconductor, surgical instruments and optical industries.

Workpieces to be lapped are placed inside the work carriers. The work carriers are gear cut on the outer diameter and recessed to hold the component inside. Abrasive fluid is fed onto the lap plates continuously.

The planetary lapping machines are ideally suited to lap thin, fragile materials like silicon and germanium wafers extensively used in electronic industries. Other materials made of tungsten, ceramics, steel, bronze, carbon, aluminium, cast iron, plastics, stainless steel, stellite, ferrite and alumina can also be lapped on these machines.

ACCURACY:

APPLICATIONS:

These machines can be very sucessfully used in:

FEATURES:

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